SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Backplane connectors are used in high-reliability applications such as computer buses and often employ secure fastening hardware for board, free-hanging, through-hole, and panel mounting depending on the contact used. Included in this category are accessories, ARINC, contacts, housings, specialized, and more.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Tray | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Tray | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | CONN HEADER XCEDE PCB | Bulk | Through Hole | XCede® | |||
| Amphenol ICC (FCI) | AIRMAX VSE 3PAIR 6IMLA H | Bulk | - | - | |||
| Amphenol ICC (FCI) | AIRMAX VSE 3PAIR 6IMLA H | Bulk | - | - | |||
![]() 10119886-101LF $12.17 | Amphenol ICC (FCI) | CONN HDR HI SPEED 54POS EDGE MT | Tube | Board Edge, Through Hole, Right Angle | Airmax VSe® | ||
| Amphenol ICC (FCI) | VSE 3X6 RH SM 2S/G SD | Tube | Board Edge, Through Hole, Right Angle | Airmax VSe® |
51720-10001204AALFView Product
278071055011515D+View Product
51722-10602000ABLFView Product
10114508-A0J-60DLFView Product
254006-EView Product
2489383-5View Product
5536397-5View Product
HM2P65PNJ1E1GFView Product
HM2P09PMJ1E4GLLFView Product
GM9FSCT0000/AAView Product
BPS8B96FLD000Z1LFView Product
HM2P07PKT1HCGFLFView Product
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
See when an inductor behaves linearly, how DC bias and saturation reduce inductance, and which current and temperature curves to check.
Read More