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Products in the audio amplifier integrated circuit (IC) family are designed specifically for replicating signal-level audio content at increased power levels sufficient to drive headphones, speakers, or similar transducers. Features such as mute inputs, volume controls, and anti-transient (depop) functions distinguish them from general purpose amplifiers. Audio amplifier classes of all types are included such as devices based on Class A, Class D, Class G topologies and others, as well as devices that integrate additional functionality such as analog-to-digital conversion in addition to the amplification function.
LM4926TL/NOPBView Product
TDA1519C/N3S,112View Product
MAX9719CEUE+View Product
LM4936MHX/NOPBView Product
MAX9725CETCView Product
MAX9726BETP+TView Product
TDA7057AQ/N2,112View Product
NJW1280RB2-TE1View Product
TPA3136D2PWPView Product
MAX9717AEUA+View Product
MAX98304EWL+TView Product
TDF8599BTH/N1/S6CYView ProductMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
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Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
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The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
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Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
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Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
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Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
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As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
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CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
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Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
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Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
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ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
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Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
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