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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family provide functions needed to interconnect an information source/sink to a sensor, transducer, actuator, transfer medium, or other such endpoint in a wide variety of esoteric or narrowly focused applications. Examples include automotive airbag drivers, body control and infotainment busses, adaptive cable equalizers, smart cards, and many others.
PI7C7300ANAEView Product
LM96570SQX/NOPBView Product
MAX3986UTU+TView Product
MAX1562HESAView Product
DS90CR218MTDXView Product
PI7C9X2G606PRCNJEXView Product
PI7C9X3G1632GPFHFCEView Product
Z8523020VSC00TRView Product
89H24NT24AG2ZBHLGIView Product
89H24NT24G2ZCHLG8View Product
73S8014RN-ILR/FView Product
USB2251I-NU-06View Product
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
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In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
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Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
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Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
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CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
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STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
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Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
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Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
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Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
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TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
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On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
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