SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Ferrite cores are devices that are designed to prevent high frequency noise or EMI (electromagnetic interference). These ferrite cores are made to be placed within an electric circuit. Key characteristics are the filter type (differential, signal, or power), number of lines, max current rating, impedance and a specified frequency, and mounting type (free hanging, surface mount, or through-hole).
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() FB060303T-102Y-S $0.01 | Cal-Chip Electronics, Inc. | FERRITE BEAD 1 KOHM 0201 1LN | Tape & Reel (TR) | Surface Mount | FB | -55°C ~ 125°C | |
![]() FB060303T-110Y-S $0.34 | Cal-Chip Electronics, Inc. | FERRITE BEAD 11 OHM 0201 1LN | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | FB | -55°C ~ 125°C | |
![]() FB060303T-121Y-S $0.22 | Cal-Chip Electronics, Inc. | FERRITE BEAD 120 OHM 0201 1LN | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | FB | -55°C ~ 125°C | |
![]() FB060303T-151Y-S $0.29 | Cal-Chip Electronics, Inc. | FERRITE BEAD 150 OHM 0201 1LN | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | FB | -55°C ~ 125°C | |
![]() FB060303T-220Y-S $0.09 | Cal-Chip Electronics, Inc. | FERRITE BEAD 22 OHM 0201 1LN | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | FB | -55°C ~ 125°C | |
![]() FB060303T-221Y-S $0.20 | Cal-Chip Electronics, Inc. | FERRITE BEAD 220 OHM 0201 1LN | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | FB | -55°C ~ 125°C | |
![]() FB060303T-241Y-S $0.01 | Cal-Chip Electronics, Inc. | FERRITE BEAD 240 OHM 0201 1LN | Tape & Reel (TR) | Surface Mount | FB | -55°C ~ 125°C | |
![]() FB060303T-250Y-S $0.30 | Cal-Chip Electronics, Inc. | FERRITE BEAD 25 OHM 0201 1LN | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | FB | -55°C ~ 125°C |
BLM21SP111SZ1DView Product
MG1608-400YView Product
Z0603C300GPWZTView Product
FBH451616T-181Y-S-HView Product
MPZ1608S101ATAH0View Product
XFEB321611-800-3AView Product
LMMGA160808T102RGView Product
BMB2A0300BN7View Product
BBBK00201209272Y00View Product
BKP1608HS600-TVView Product
HI1206N601R-10View Product
EBMS160808H680View ProductSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More