SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 36FMN-SMT-A-TF $0.53 | JST Sales America Inc. | CONN FFC TOP 36POS 1MM R/A | Tape & Reel (TR) | Surface Mount, Right Angle | FMN | -25°C ~ 85°C | |
![]() 37FMN-BMT-A-TF $0.57 | JST Sales America Inc. | CONN FFC VERT 37POS 1MM SMD | Tape & Reel (TR) | Surface Mount | FMN | -25°C ~ 85°C | |
![]() 38FMN-SMT-A-TF $0.54 | JST Sales America Inc. | CONN FFC TOP 38POS 1MM R/A | Tape & Reel (TR) | Surface Mount, Right Angle | FMN | -25°C ~ 85°C | |
![]() 39-53-2214 $4.58 | Molex | CONN FFC FPC TOP 21POS 1.25MM RA | Tray | - | * | - | |
![]() 39513033 $0.89 | Molex | CONN FFC FPC TOP 3POS 1.25MM R/A | Tray | Through Hole, Right Angle | 5597 | -20°C ~ 80°C | |
![]() 39513034 $0.89 | Molex | CONN FFC VERT 3POS 1.25MM PCB | Tray | Through Hole | 5597 | -20°C ~ 80°C | |
![]() 39513043 $0.48 | Molex | CONN FFC FPC TOP 4POS 1.25MM R/A | Tray | Through Hole, Right Angle | 5597 | -20°C ~ 80°C | |
![]() 39513044 $0.87 | Molex | CONN FFC VERT 4POS 1.25MM PCB | Tray | Through Hole | 5597 | -20°C ~ 80°C |

The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read MoreDutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More