SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are interconnect products used in conjunction with Flat Flexible Cable (FFC) and Flexible Printed Circuit (FPC) materials and are predominantly of the sort which perform a cable-to-board interconnect function, being mounted to a printed circuit board, and providing both electrical connection and mechanical retention for an inserted FFC or FPC cable.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 52271-2679-TR250 $0.83 | Molex | Easy-On FFC/FPC Conn 1.00mm | Tape & Reel (TR) | - | * | - | |
![]() 52271-3079-TR250 $0.96 | Molex | 1.0 FPC ZIF For SMT 30Ckt | Tape & Reel (TR) | - | * | - | |
![]() 522710469 $0.96 | Molex | CONN FPC BOTTOM 4POS 1MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | 52271 | -40°C ~ 85°C | |
![]() 522710479 $0.76 | Molex | CONN FPC BOTTOM 4POS 1MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | 52271 | -40°C ~ 85°C | |
![]() 522710569 $0.90 | Molex | CONN FPC BOTTOM 5POS 1MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | 52271 | -40°C ~ 85°C | |
![]() 522710579 $0.87 | Molex | CONN FPC BOTTOM 5POS 1MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | 52271 | -40°C ~ 85°C | |
| Molex | CONN FPC BOTTOM 5POS 1MM R/A | Bulk | Surface Mount, Right Angle | Easy-On 52271 | -40°C ~ 85°C | ||
![]() 522710669 $0.99 | Molex | CONN FPC BOTTOM 6POS 1MM R/A | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Right Angle | 52271 | -40°C ~ 85°C |

A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
See how a MEMS gyroscope measures angular rate, why its angle estimate drifts, and which range, noise, interface and temperature specs to compare.
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More