SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Fiber optic transceiver modules are fiber cable adaptive housings that contain a light source for transmitting data via fiber optic cable as well as a photodiode for receiving fiber optic data. Mounting options include pluggable CXP, QSFP, SFF, SFP, and XFP, surface or through-hole, CFP, 1x9 SC, and panel. Data rate, wavelength, application and connector type are among the primary selection parameters.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() AFBR-5805ATZ-C $39.60 | ATGBICS | Compatible 1x9 100Mb | Tray | Through Hole | Avago Broadcom® Compatible | ||
![]() AFBR-5805AZ $40.94 | Broadcom Limited | TXRX ATM SONET OC3 3V SC 1X9 | Bulk | Through Hole | - | ||
![]() AFBR-5805AZ-3.3V-C $42.30 | ATGBICS | Compatible 1x9 100Mb | Tray | Through Hole | Avago Broadcom® Compatible | ||
![]() AFBR-5805AZ-5V-C $42.30 | ATGBICS | Compatible 1x9 100Mb | Tray | Through Hole | Avago Broadcom® Compatible | ||
![]() AFBR-5805AZ-C $42.30 | ATGBICS | Compatible 1x9 100Mb | Tray | Through Hole | Avago Broadcom® Compatible | ||
![]() AFBR-5805TZ $24.12 | Broadcom Limited | TXRX ATM SONET OC3 3V ST 1X9 | Bulk | Through Hole | - | ||
![]() AFBR-5805TZ-3.3V-C $37.80 | ATGBICS | Compatible 1x9 100Mb | Tray | Through Hole | Avago Broadcom® Compatible | ||
![]() AFBR-5805TZ-5V-C $37.80 | ATGBICS | Compatible 1x9 100Mb | Tray | Through Hole | Avago Broadcom® Compatible |
AFCT-5765ATLZView Product
E100GQSFP28LRX-I-CView Product
SFP-FC4G-LW-HW-CView Product
1100-0559 GSLC20-BiDi-B-CView Product
XFP-10G-Z-OC192-LR2-DW5817-CView Product
DWDM-SFP-3504-T-I-CView Product
SFP10GBLRMSTView Product
FXC-XFB-2340-10-CYNView Product
QSFP-100G-PSM4-AR-CView Product
CWDM-SFP-1G-1390-80-I-MSA-ATView Product
SFP-10GB-DW20-80-HW2-CView Product
280-0330-00-CView Product
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More