SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Film capacitors are based on the use of plastic film materials as a dielectric. An electrostatic (non-polarized) capacitor type having generally favorable parameter stability and loss characteristics relative to other types, a wide variety of construction and material variations exist that allow film capacitors to be adapted for a wide range of purposes, ranging from small-signal applications in which ceramics are competitive to power applications where electrolytics are the likely alternative.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() B32522D8224K000 $0.48 | EPCOS - TDK Electronics | CAP FILM 0.22UF 10% 630VDC RAD | Bulk | Through Hole | B3252* - MKT General Purpose | -55°C ~ 125°C | |
![]() B32522D8473K000 $0.19 | EPCOS - TDK Electronics | CAP FILM 0.047UF 10% 630VDC RAD | Bulk | Through Hole | B3252* - MKT General Purpose | -55°C ~ 125°C | |
![]() B32522D8473K189 $0.20 | EPCOS - TDK Electronics | CAP FILM 0.047UF 10% 630VDC RAD | Tape & Reel (TR) | Through Hole | B3252* - MKT General Purpose | -55°C ~ 125°C | |
![]() B32522D8683K000 $0.23 | EPCOS - TDK Electronics | CAP FILM 0.068UF 10% 630VDC RAD | Bulk | Through Hole | B3252* - MKT General Purpose | -55°C ~ 125°C | |
![]() B32522D8683K189 $0.23 | EPCOS - TDK Electronics | CAP FILM 0.068UF 10% 630VDC RAD | Tape & Reel (TR) | Through Hole | B3252* - MKT General Purpose | -55°C ~ 125°C | |
![]() B32522E6104K000 $0.61 | EPCOS - TDK Electronics | CAP FILM 0.1UF 10% 400VDC RADIAL | Bulk | Through Hole | B3252* - MKT General Purpose | -55°C ~ 125°C | |
![]() B32522E6104K189 $0.73 | EPCOS - TDK Electronics | CAP FILM 0.1UF 10% 400VDC RADIAL | Tape & Reel (TR),Cut Tape (CT) | Through Hole | B3252* - MKT General Purpose | -55°C ~ 125°C | |
![]() B32522E6104M189 $0.19 | EPCOS - TDK Electronics | CAP FILM 0.1UF 20% 400VDC RADIAL | Tape & Reel (TR) | Through Hole | B3252* - MKT General Purpose | -55°C ~ 125°C |
BFC236521104View Product
SNMPU026807BB8JS00View Product
BFC236951392View Product
BFC2370GC153View Product
ECW-FE2W104Q5View Product
SMDTF02470TA00KQ00View Product
B32521C3473J189View Product
SNMPJ043007HD4JSSDView Product
MKX2AW43306I00MSSDView Product
MKP383312140JFM2B0View Product
DCP4H152507F1HKS00View Product
R79MC2100JH40KView Product
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read MoreON Semiconductor (onsemi), a global leader in intelligent power and sensing technologies, has announced plans to implement price adjustments for select product lines, effective…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More