SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Pressure Sensors or Transducers are designed to detect and respond to the presence or a change in the amount of force on the device. The pressure types are Absolute, Compound, Differential, Gauge, Sealed Gauge, Switch, Vacuum, and Vented Gauge with operating pressures from -100PSI (-689.48kPa) to 20000PSI (137895.15kPa).
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() ELVH-M100G-HRRD-C-NAA5 $33.74 | Amphenol All Sensors Corporation | SENSOR 1.45PSIG 0.06" 8DIP | Tray | 8-DIP | Through Hole | ELV | 0°C ~ 50°C |
![]() ELVH-M160D-HRRD-C-N2A5 $30.83 | Amphenol All Sensors Corporation | SENSOR 2.32PSID 0.06" 14BIT 8DIP | Tray | 8-DIP | Through Hole | ELV | 0°C ~ 50°C |
![]() ELVH-M160D-HRRD-C-PSA5 $33.78 | Amphenol All Sensors Corporation | SENSOR 2.32PSID 0.06" 14BIT 8DIP | Tray | 8-DIP | Through Hole | ELV | 0°C ~ 50°C |
![]() ELVH-M160G-HKNJ-C-N5A4 $30.05 | Amphenol All Sensors Corporation | SENSOR 2.32PSIG 0.11" 14BIT | Tray | - | Surface Mount | ELV | 0°C ~ 50°C |
![]() ELVH-M250D-HRRD-C-NSA4 $30.70 | Amphenol All Sensors Corporation | SENSOR 3.63PSID 0.06" 14BIT 8DIP | Bulk | 8-DIP | Through Hole | ELV | 0°C ~ 50°C |
![]() ELVH-M250D-HRRD-C-PSA5 $33.78 | Amphenol All Sensors Corporation | SENSOR 3.63PSID 0.06" 14BIT 8DIP | Tray | 8-DIP | Through Hole | ELV | 0°C ~ 50°C |
![]() ELVH-M250D-HRRJ-C-N4A4 $30.18 | Amphenol All Sensors Corporation | SENSOR 3.63PSID 0.06" 14BIT | Tray | - | Surface Mount | ELV | 0°C ~ 50°C |
![]() ELVH-M250D-HRRJ-C-NAA4 $33.27 | Amphenol All Sensors Corporation | SENSOR 3.63PSID 0.06" | Tray | - | Surface Mount | ELV | 0°C ~ 50°C |
PT30-15psiv-1-13-2-3View Product
MPRLS0300YG00001BView Product
PT30-200psic-1-1-50-17-CCView Product
PT30-15psic-1-1-50-34-ST8View Product
PT40-150psig-2-2-2-25-CCView Product
PT40-15psiv-2-5-8-25-ST8View Product
PT40-4000psig-2-1-45-70-ST8-CCView Product
PT40-750psig-1-1-8-14-ST8-CCView Product
PTF30-G9NB-F8View Product
PT40-3000psig-1-5-9-25-ST8-CCView Product
PT30-5psig-1-5-2-21-ST8View Product
PT40-500psig-1-1-2-3-ST8View Product
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More