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1N1345C is listed in the Single Diodes range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE STANDARD 300V 16A DO4. Review the specifications below when checking this part for your BOM.
The Microchip Technology 1N1345C is a standard silicon power rectifier diode housed in the DO-203AA (DO-4) axial leaded package. It features a maximum repetitive peak reverse voltage of 300V and an average rectified forward current rating of 16A. The device utilizes glass passivation for environmental protection and offers a high surge current capability, making it suitable for general-purpose power supply applications requiring robust rectification.
Verify the manufacturer origin, as historical data indicates production by Microsemi Corporation prior to its acquisition by Microchip Technology. Confirm that the component meets RoHS compliance standards if required for your specific assembly process. Ensure the package matches the DO-203AA specification to guarantee mechanical fitment on the printed circuit board.
Select this component when a 16A continuous current capacity and 300V blocking voltage are required in a traditional axial leaded form factor. Consider the thermal management requirements associated with high-current rectification in enclosed spaces. Evaluate the surge rating against potential inrush currents in the target application to ensure long-term operational stability.
This part belongs to the family of standard silicon power rectifiers manufactured by Microchip Technology. It serves as a legacy component often used in industrial equipment and consumer electronics where reliable, high-current rectification is necessary. The DO-4 package provides a robust mechanical connection suitable for through-hole mounting techniques commonly found in older or heavy-duty designs.
Check for direct equivalents from other manufacturers offering identical electrical ratings and pin configurations. Verify that any substitute maintains the same DO-203AA package dimensions and lead spacing to ensure compatibility with existing footprints.
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