1N4596R

Single Diodes Overview

The 1N4596R is a silicon standard recovery rectifier diode manufactured by GeneSiC Semiconductor. It features a single-element configuration with a maximum average forward current of 150 A and a repetitive peak reverse voltage rating of 1400 V. The device utilizes a DO-8 stud mount package, supporting operation within a temperature range of -60 °C to +200 °C. Key electrical characteristics include a maximum forward voltage of 1.5 V and a surge current capability of 3000 A.

Single Diodes Feature Summary

• Standard recovery silicon construction for general-purpose rectification
• High thermal stability enabling operation up to 200 °C junction temperature
• Robust mechanical design via stud mount packaging for high-power applications

Single Diodes Applications

• Industrial power supplies
• Motor drive rectification
• General purpose high-voltage rectification

Single Diodes Procurement Notes

Verify the manufacturer designation carefully, as the 1N4596R part number is associated with GeneSiC Semiconductor in official documentation rather than Powerex Inc. Confirm the specific datasheet version and package details (DO-8) prior to procurement to ensure compatibility with existing designs. Cross-reference technical specifications against the latest official component data sheets.

Single Diodes Selection Notes

Select this component for applications requiring high current handling and elevated operating temperatures. The 1400 V reverse voltage rating suits medium-to-high voltage systems. Ensure the mounting interface supports the DO-8 stud mount form factor. Evaluate thermal management requirements given the 150 A continuous current rating and 200 °C maximum junction temperature capability.

Single Diodes Part Context

This component belongs to the family of high-power silicon rectifier diodes designed for industrial environments. It provides a robust solution for converting AC to DC in demanding power electronics circuits. The study mount configuration facilitates efficient heat dissipation through direct chassis or heatsink attachment, distinguishing it from leaded or surface-mount alternatives.