1N4619E3

Single Zener Diodes Overview

The Microchip Technology 1N4619E3 is a Zener diode with a nominal voltage of 3 V and a power dissipation rating of 500 mW. It features a 5% voltage tolerance and operates within a temperature range of -65 °C to +175 °C. The device utilizes a DO-35 axial leaded package and includes an internal metallurgical bond for enhanced reliability.

Single Zener Diodes Feature Summary

• Internal metallurgical bond construction
• Qualified per MIL-PRF-19500/435
• RoHS compliant commercial version

Single Zener Diodes Applications

• High reliability voltage regulation
• Military aerospace circuits
• Temperature compensated references

Single Zener Diodes Procurement Notes

Verify the specific qualification level (JAN, JANTX, JANTXV, or JANS) required for your application, as the base part number may be available in multiple military grades. Confirm RoHS compliance status if environmental regulations apply, noting that commercial versions are typically compliant while military grades may differ. Ensure the DO-35 through-hole package matches your PCB footprint requirements.

Single Zener Diodes Selection Notes

Select this component when a 3 V reference is needed in a standard glass axial package. The internal metallurgical bond distinguishes it from standard commercial equivalents by offering superior mechanical stability. Consider the 500 mW power limit and wide operating temperature range suitable for harsh environments.

Single Zener Diodes Part Context

This part belongs to the 1N4614-1 through 1N4627-1 series of 500 mW Zener diodes manufactured by Microchip Technology. These devices are designed for high-reliability applications and are qualified under the MIL-PRF-19500/435 specification. The series offers various voltage options in the DO-35 package.

Single Zener Diodes Replacement Considerations

Direct substitutes include other manufacturers' 1N4619 variants meeting MIL-PRF-19500/435 specifications. Verify that any replacement maintains the 500 mW power rating, DO-35 package dimensions, and metallurgical bond construction.