1N4989

Single Zener Diodes Overview

The Microchip Technology 1N4989 is a military-qualified, voidless hermetically sealed glass Zener diode rated at 5 watts. It features a nominal Zener voltage of 200 V with a standard tolerance of ±5%. The device operates within a junction temperature range of -65°C to +175°C and utilizes an E-package axial lead configuration. Key electrical characteristics include a maximum reverse leakage current of 2 µA at 152 V and a maximum Zener impedance of 500 Ω at the test current of 5 mA.

Single Zener Diodes Feature Summary

• Hermetically sealed voidless-glass construction with internal metallurgical bonds for high reliability
• Military qualification compliant with MIL-PRF-19500/356 standards
• Inherently radiation hard and non-sensitive to electrostatic discharge

Single Zener Diodes Applications

• High-reliability aerospace systems
• Defense electronics requiring failure-intolerant components
• Harsh environment power regulation circuits

Single Zener Diodes Procurement Notes

Verify that the specific ordering suffix matches the required performance grade (JAN, JANTX, JANTXV, or JANS) as defined in the manufacturer's datasheet. Confirm package type and termination finish requirements against project specifications before finalizing orders.

Single Zener Diodes Selection Notes

Select this component for applications demanding robustness in extreme thermal conditions up to 175°C. Ensure circuit design accommodates the specified surge current limits and derating curves to maintain safe operation under transient loads.

Single Zener Diodes Part Context

This part belongs to the industry-standard 1N4954 through 1N4996 series of 5-watt Zener regulators. These devices are widely recognized for their durability and consistent performance in critical infrastructure and military-grade electronic assemblies.

Single Zener Diodes Replacement Considerations

Surface-mount equivalents are available in square end-cap MELF packages with the 'US' suffix (e.g., 1N4989US). Verify pinout compatibility and thermal management differences when transitioning between axial and surface-mount variants.