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1N5263BUR-1 is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE ZENER 56V 500MW DO213AA. Review the specifications below when checking this part for your BOM.
The Microchip Technology 1N5263BUR-1 is a surface mount Zener voltage regulator with a nominal breakdown voltage of 56 V and a maximum power dissipation of 0.5 W. It utilizes a hermetically sealed DO-213AA (MELF) package featuring an internal metallurgical bond. The device maintains a voltage tolerance of ±5% and operates within a junction temperature range of -65°C to +175°C. Electrical characteristics include a test current of 2.2 mA, a maximum dynamic impedance of 150 Ohms at the test point, and a maximum reverse leakage current of 100 µA.
Verify that the specific part number matches the required tolerance suffix and RoHS compliance status. Confirm the package type corresponds to the DO-213AA specification. Ensure the procurement documentation aligns with the manufacturer's screening requirements if military-grade performance is necessary. Cross-reference the datasheet electrical limits against the application constraints before finalizing orders.
Select this component when a hermetically sealed surface mount Zener diode is required for high-reliability applications. The 56 V rating and 500 mW dissipation capability define the operational envelope. Consider the positive temperature coefficient above 5 V for thermal stability. Verify that the lead-free or tin-lead terminal options meet the assembly process requirements.
This device belongs to the 1N5221BUR-1 through 1N5281BUR-1 series, which provides surface mount equivalents to the JEDEC registered axial-leaded 1N5221 through 1N5281 series. The series covers a wide voltage range from 2.4 V to 200 V. The BUR-1 designation specifically indicates the metallurgically bonded surface mount configuration available in commercial grades.
The 1N5263BUR-1 serves as a direct surface mount replacement for the axial 1N5263B. Designers must account for the physical footprint differences between the DO-213AA package and the traditional DO-35 axial package during PCB layout modifications.
The temperature coefficient is +0.096 %/°C.
No, the device is non-sensitive to ESD according to MIL-STD-750 method 1020.
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