2112531

Overview

The SICK 2112531 is a V2D611P-MMSCI4 2D snapshot sensor designed for industrial quality inspection. It features a CMOS global shutter monochrome imaging technology with adjustable manual focus. The device includes integrated dual-color LED illumination (yellow at 617 nm and blue at 470 nm) and auxiliary alignment LEDs. It operates within a working range of 50 mm to 300 mm using internal lighting. The unit supports the SICK Algorithmus API HALCON and includes the Nova Inspector application software with a Quality Inspection License.

Feature Summary

• Implements 2D snapshot technology utilizing a CMOS global shutter sensor for precise image capture.
• Equipped with integrated multi-wavelength LED illumination including yellow and blue light sources.
• Supports programmable configuration and customization via included Nova Inspector software.
• Compatible with external algorithmic tools through the SICK Algorithmus API HALCON.

Applications

• Quality inspection in automated manufacturing processes
• Component presence verification
• Dimensional checking of small parts

Procurement Notes

Verify that the specific ordering code matches the required optical specifications, particularly the integrated illumination wavelengths and lens focal length. Confirm software license inclusion for Nova Inspector and HALON API support. Ensure environmental ratings meet operational site requirements. Cross-reference the part number against official SICK documentation to confirm current production status and technical validity before procurement.

Selection Notes

Select this model when fixed-focus or manually adjustable lenses are sufficient for the target object distance. Choose this variant if the application requires specific yellow or blue light wavelengths for material contrast enhancement. Consider this sensor for tasks requiring integration with HALCON-based algorithms. Evaluate the 50-300 mm working range against the physical constraints of the assembly line setup.

Part Context

This component belongs to the V2D series of 2D snapshot sensors from SICK. These devices are engineered for high-speed image acquisition in industrial automation environments. The series focuses on providing reliable visual data for machine vision applications without the complexity of 3D profiling systems.

Replacement Considerations

Consult official SICK substitution guides for updated models with enhanced resolution or different interface protocols. Verify mechanical mounting dimensions and connector types when considering alternative units within the same product family.