SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 22130233 is a cover frame designed for electronics packaging systems. It features dimensions of 1600mm in height and 600mm in width, constructed from material code 7035. This component serves as a structural element within rack assemblies, providing enclosure coverage.
Verify the exact material specification corresponding to code 7035 against official nVent SCHROFF documentation before procurement. Confirm dimensional tolerances for 1600H x 600W fitment within your specific rack framework. Ensure compatibility with adjacent panel components to maintain structural integrity and alignment standards required for your installation environment.
Select this unit when a fixed cover panel is required for a 1600mm high, 600mm wide rack opening. Evaluate whether the static nature of a cover frame meets your thermal or access requirements compared to hinged doors. Ensure the mounting plane aligns with your existing subrack or cabinet structure specifications.
This part belongs to the nVent SCHROFF range of electronics packaging solutions. The brand specializes in modular rack systems, cabinets, and accessories for industrial and laboratory applications. The 22130233 model is a specific dimensional variant within their broader portfolio of frame and panel components.
No public substitute part numbers are confirmed for this specific dimension and material combination.

Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
Recently, the global electronic component market has witnessed complex and changeable trends. In the memory chip sector, the wave of price increases continues to…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More