SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 24560-840 is a horizontal rail insulation strip designed for rack mounting systems. It features a width of 40HP and is constructed from polycarbonate material. The component serves as an insulating element to enable the insulated mounting of backplanes or metal plates, which act as supports for connectors within the enclosure structure.
Verify the manufacturer part number 24560-840 against official nVent SCHROFF documentation to confirm specifications. Ensure compatibility with existing rack frames and connector requirements. Check for RoHS compliance status if required by project standards. Confirm material composition matches polycarbonate specifications.
Select this component when electrical isolation between mounted backplanes and the rack frame is necessary. The 40HP width must align with the specific horizontal rail spacing of the target enclosure system. Polycarbonate construction offers durability for standard industrial environments requiring connector support stability.
This item belongs to the nVent SCHROFF range of rack accessories and enclosure components. It functions specifically as an insulating strip rather than a structural load-bearing rail. The product is categorized under horizontal rails and is intended for use within standardized 19-inch or similar modular rack architectures.
No public confirmed substitute part numbers are available for direct replacement.

Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More