SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 24571101 is a desktop enclosure belonging to the Ratiopac PRO series, designed for electronic equipment mounting. It features an aluminum construction with a grey finish and provides EMC shielding capabilities. The unit measures 265.9 mm in height, 315.5 mm in width, and 315 mm in depth. It accommodates 6 HE (Height Units) and 28 HP (Horizontal Pitch/TE) modules. The enclosure includes a front panel and offers IP20 protection rating. It is intended for use with 19-inch panel width racks.
Verify exact dimensional tolerances and EMC shielding specifications against current nVent SCHROFF documentation before procurement. Confirm availability status as some related products may be discontinued or subject to long lead times. Ensure compatibility with required 19-inch rack standards and module pitch requirements.
Select this model when a desktop form factor with EMC shielding is required for 6U height applications. Verify that the 28HP width meets module density needs. Consider accessory kits for enhanced side panel coverage if higher shielding effectiveness is necessary compared to standard configurations.
This component is part of the Ratiopac PRO series by nVent SCHROFF, specializing in electronics packaging design. The series focuses on modular rack solutions with standardized dimensions. The 24571101 specifically addresses desktop installation scenarios requiring robust metal enclosure properties and electromagnetic compatibility features.
Check for discontinued status alternatives such as 24571585 or other Ratiopac PRO variants. Verify dimensional equivalence for 6HE/28HP configurations. Consult official catalogs for updated product lines replacing older manufacturing batches.

Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
Explore electronic component types, functions, packages and datasheets. Learn selection, replacement and BOM checks before ordering parts for your PCB.
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More