SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 24813505 is a PIU W.COVER EMC component designed for 6U rack systems with a 5HP width and 167mm depth. This cover provides electromagnetic compatibility shielding for open rack structures. It is constructed to meet industrial standards for electronic enclosures, ensuring effective interference suppression in embedded computer system applications.
Verify the exact dimensional requirements against your specific rack chassis before ordering. Confirm that the 167D depth specification aligns with your internal component layout. Ensure compatibility with the 6U/5HP standard format required by this specific cover plate model.
Select this component when EMC shielding is required for open-frame 6U rack modules. Ensure the host system supports the 5HP width dimension. Verify that the 167mm depth does not conflict with rear-access cabling or connector placement needs within the enclosure.
This part belongs to the nVent SCHROFF range of rack accessories and enclosure solutions. The brand specializes in modular, scalable electronics cabinets and subracks for embedded computing. This specific item serves as a functional accessory rather than a standalone enclosure unit.
No public confirmed substitute part numbers are available in the provided documentation. Consult official nVent SCHROFF catalogs for equivalent EMC covers matching 6U/5HP specifications.

An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read More
Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More