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25AA256-I/P is listed in the Memory IC range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC EEPROM 256KBIT SPI 10MHZ 8DIP. Review the specifications below when checking this part for your BOM.
The Microchip Technology 25AA256-I/P is a 256 Kbit (32,768 x 8-bit) Serial Electrically Erasable PROM accessed via an SPI-compatible serial bus. It operates within a supply voltage range of 1.8V to 5.5V and supports clock frequencies up to 10 MHz at higher voltages. The device features self-timed erase and write cycles with a maximum duration of 5 ms. It includes block write protection capabilities and built-in power-on/off data protection circuitry. The component is housed in an 8-lead PDIP package and is rated for industrial temperature operation from -40°C to +85°C.
Verify that the specific part number suffix matches the required voltage range and temperature grade. Confirm the package type corresponds to the design requirements. Ensure compliance with RoHS directives if applicable. Check for automotive AEC-Q100 qualification if the application demands it. Validate the manufacturer source against official Microchip documentation.
Select this component when an SPI interface is preferred over I2C for memory access. Choose the 25AA256 variant specifically for applications requiring operation down to 1.8V, as opposed to the 2.5V minimum of the 25LC256 series. Consider the PDIP package only for through-hole mounting designs. Evaluate the need for page write capabilities and block protection levels before finalizing the selection.
This device belongs to the 25XX256 family of serial EEPROMs from Microchip Technology. It shares functional similarities with the 25LC256 but differs in its lower operating voltage range. The family is designed for general-purpose non-volatile memory applications requiring reliable data retention and high endurance.
The 25LC256-I/P is a compatible alternative within the same family, though it requires a minimum supply voltage of 2.5V rather than 1.8V. Other packages such as SOIC or TSSOP may be used if form factor changes are acceptable.
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