Edgeboard Connectors 3-1367703-2 product image

3-1367703-2

$40.37
  • Description:CONN AMC B+ FEMALE 170POS 0.029
  • Series:AdvancedTCA
  • Mfr:TE Connectivity AMP Connectors
  • Package:Bulk,Tray

SKU:f1e98a9b6929 Category: Brand:

  
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3-1367703-2 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN AMC B+ FEMALE 170POS 0.029. Review the specifications below when checking this part for your BOM.

Edgeboard Connectors specifications for 3-1367703-2

  • Description:CONN AMC B+ FEMALE 170POS 0.029
  • Series:AdvancedTCA
  • Mfr:TE Connectivity AMP Connectors
  • Package:Bulk,Tray
  • Card Type:Advanced Mezzanine Card B+, MicroTCA
  • Gender:Female
  • Number of Positions/Bay/Row:85
  • Number of Positions:170
  • Card Thickness:0.063" (1.60mm)
  • Number of Rows:2
  • Pitch:0.029" (0.75mm)
  • Read Out:Dual
  • Features:-
  • Mounting Type:Through Hole, Right Angle
  • Termination:Press-Fit
  • Contact Material:Copper Alloy
  • Contact Finish:Gold or Gold-Palladium
  • Contact Finish Thickness:-
  • Contact Type:-
  • Color:Black
  • Flange Feature:-
  • Operating Temperature:-

Edgeboard Connectors datasheet and documents for 3-1367703-2

3-1367703-2

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 3-1367703-2 is a 170-position female card edge connector belonging to the AMC B+ series. It features a 0.029-inch (0.75mm) pitch and utilizes gold or gold-palladium contact plating for reliable signal transmission. The housing is black, designed specifically for Advanced Mezzanine Card and MicroTCA applications. This component serves as a high-density interconnect solution within its designated product family.

Edgeboard Connectors Feature Summary

  • Designed for Advanced Mezzanine Card B+ and MicroTCA system architectures
  • Female card edge connector configuration with 170 positions
  • Gold or gold-palladium contact plating options available

Edgeboard Connectors Applications

  • Advanced Mezzanine Card (AMC) interconnects
  • MicroTCA chassis backplane connections
  • High-density mezzanine card systems

Edgeboard Connectors Procurement Notes

Verify the specific contact plating variant required for your application, as the datasheet indicates availability in either gold or gold-palladium finishes. Confirm that the 170-position count aligns with your board design requirements. Ensure compatibility with the AMC B+ standard before finalizing procurement decisions.

Edgeboard Connectors Selection Notes

Select this component when designing for AMC B+ or MicroTCA form factors requiring a 170-position female interface. Consider the 0.029-inch pitch constraints during PCB layout. Evaluate the need for gold versus gold-palladium contacts based on environmental conditions and mating cycle requirements specified in the official documentation.

Edgeboard Connectors Part Context

This connector belongs to the AMC B+ series by TE Connectivity AMP Connectors. It is engineered to support high-speed data transfer in compact mezzanine card environments. The 170-position count provides substantial I/O density within the standardized footprint defined by the AMC B+ specification.

Edgeboard Connectors Replacement Considerations

Consult official TE Connectivity documentation for direct cross-reference part numbers. Verify mechanical dimensions and electrical specifications against any potential substitute components to ensure full compatibility with existing AMC B+ designs.

3-1367703-23-1367703-2
$40.37
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