302-024-256-201

Edgeboard Connectors Overview

The EDAC Inc. 302-024-256-201 is a standard card edge connector from the 302 series, designed for dual-edge non-specified cards. It features 24 positions with a contact spacing of 0.050 inches (1.27mm). The connector utilizes gold flash plated contacts and has a black housing. It supports board thicknesses ranging from 0.051 to 0.071 inches (1.30mm to 1.80mm) and operates within a temperature range of -55°C to +85°C.

Edgeboard Connectors Feature Summary

• Dual-row configuration with extender board tails for secure mounting
• Gold flash plated contacts ensure reliable electrical performance
• Compatible with non-specified dual-edge card types

Edgeboard Connectors Applications

• General purpose electronic interconnects
• Industrial control systems
• Communication equipment

Edgeboard Connectors Procurement Notes

Verify the specific ordering suffix to confirm contact plating and housing color attributes. Ensure compatibility with the target PCB layout regarding row count and pin pitch. Confirm that the selected variant matches the required mechanical retention style for the application environment.

Edgeboard Connectors Selection Notes

Select this component when a low-profile, high-density connection is required for dual-edge cards. The 1.27mm pitch allows for compact designs. Verify that the operating temperature range meets the environmental requirements of the end-use device before finalizing the design.

Edgeboard Connectors Part Context

This part belongs to the EDAC 302 series of standard card edge connectors. The series offers various position counts and configurations. This specific model provides a mid-range contact count suitable for applications requiring moderate I/O density in a small form factor.

Edgeboard Connectors Replacement Considerations

Direct substitutes include other EDAC 302 series parts with matching pin counts, such as 302-012-256-201 or 302-048-256-201, provided the position count difference is acceptable. Cross-brand replacements require verification of pitch, height, and retention mechanism.