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305-018-556-212 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 18POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-018-556-212 is a standard card edge connector from the 305 series, designed for vertical panel mounting. It features an 18-position dual-row configuration with a 3.96 mm (0.156 inch) pitch and a 3.56 mm row spacing. The connector supports a maximum board thickness of 1.57 mm and utilizes gold-plated copper alloy contacts to ensure reliable signal transmission. Rated for 5 A current, it employs a solder lug termination method for secure PCB attachment. Constructed with a thermoplastic housing, this component operates within a temperature range of -40°C to +105°C and provides an insulation resistance of 5 GOhms.
Verify that the specific suffix 212 corresponds to the green thermoplastic housing variant as documented in official EDAC datasheets. Confirm that the solder lug termination type matches the target PCB pad layout, distinguishing it from pin-based alternatives. Ensure compliance with RoHS directives if required by the end application. Cross-reference the 18-position count and 3.96 mm pitch against schematic requirements to prevent mating errors with incompatible card edge modules.
Select this model when a dual-row, 18-position connector with a 3.96 mm pitch is required for vertical panel installation. The solder lug termination is suitable for applications where through-hole soldering is preferred over surface mount pins. Consider the 5 A current rating and 105°C operating limit for thermal management planning. This part is distinct from similar EDAC models differing only in housing color or termination style, so verify the exact suffix code to ensure functional compatibility with existing designs.
This component belongs to the EDAC 305 series of standard card edge connectors, which are widely used in modular electronic systems. The series offers various position counts and termination options to support diverse interface needs. The 305-018-556-212 specifically addresses applications requiring a mid-range position count with robust panel-mount capabilities. Its design aligns with industry-standard dimensions for card edge modules, ensuring interoperability with compatible mating parts across different manufacturers within the same specification framework.
Direct substitutes must match the 18-position count, 3.96 mm pitch, dual-row configuration, and solder lug termination. Verify that alternative vendors offer components with identical panel mount orientation and gold-plated contacts. Generic equivalents may differ in housing material or insulation resistance; therefore, cross-check technical specifications against the original EDAC datasheet before implementation to maintain system integrity.
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