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305-026-520-212 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 26POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-026-520-212 is a standard card edge connector featuring 26 positions with a 3.96 mm (0.156 inch) contact spacing and 3.56 mm row spacing. Designed for .062 inch (1.57 mm) nominal thickness printed circuit boards, it utilizes gold-plated copper alloy contacts rated at 5 A current. The component employs a thermoplastic polyester insulator body and solder pin termination for secure panel mount installation.
Verify the specific manufacturer part number against official EDAC documentation to confirm compatibility with your design requirements. Ensure that the ordering suffix matches the required termination style and plating specifications. Cross-reference the datasheet for environmental ratings and mechanical dimensions before finalizing procurement decisions.
Select this connector when a dual-row card edge interface with 3.96 mm pitch is required. It is suitable for applications demanding robust panel mounting and high-current capability. Consider the physical board thickness constraints and verify that the solder pin termination aligns with the assembly process capabilities of the manufacturing facility.
This component belongs to the EDAC 305 series of standard density card edge connectors. The series offers various position counts while maintaining consistent 3.96 mm spacing. These connectors are engineered for durability in demanding environments, providing stable signal transmission between circuit boards and host systems through precise mechanical alignment.
Consult official EDAC substitution guides for verified alternative part numbers within the same series. Ensure any replacement maintains identical contact spacing, board thickness acceptance, and termination type to guarantee mechanical fit and electrical performance without redesigning the footprint.
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