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305-028-500-504 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 28POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-028-500-504 is a standard card edge connector from the 305 series, designed for panel mount applications with a vertical orientation. It features 28 positions arranged in two rows with a contact spacing of 3.96 mm (0.156 inches). The connector accepts printed circuit boards with a nominal thickness of 1.57 mm (.062 inches). Contacts are constructed from copper alloy and finished with gold plating to ensure reliable electrical performance. The unit provides a continuous current rating of 5 A and supports an operating temperature range from -40°C to +105°C.
Verify that the specific part number matches the required position count and row configuration before ordering. Confirm compatibility with the target PCB thickness of 1.57 mm to ensure proper mechanical engagement. Check for any regional distribution restrictions or availability limitations associated with the manufacturer's supply chain at the time of purchase.
Select this component when a dual-row card edge interface with 3.96 mm pitch is required for panel installation. Ensure the application environment falls within the specified -40°C to +105°C operational temperature range. Verify that the mating PCB design accommodates the necessary polarizing key slots and utilizes compatible contact materials.
This connector belongs to the EDAC 305 series, which defines a family of standard card edge connectors characterized by .156 inch contact spacing. The series offers various position counts and termination options, all sharing common mechanical dimensions and material specifications for interchangeability within panel-mount designs.
Compatible substitutes within the same series include the 305-028-520-504, which shares identical mechanical and electrical specifications. Other variants in the 305 series may serve as alternatives if position counts differ but form factors remain consistent.
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