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305-030-555-501 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 30POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-030-555-501 is a standard card edge connector designed for dual-edge board applications. It features 30 positions with a 3.96 mm (0.156 inch) pitch. The connector utilizes gold-plated copper alloy contacts and a green thermoplastic insulator. It supports a current rating of 5 A and operates within a temperature range of -40°C to +105°C. Designed for panel mounting, it accommodates board thicknesses between 1.37 mm and 1.78 mm.
Verify the specific ordering suffix against the official EDAC datasheet to confirm exact termination style and flange characteristics. Ensure the target PCB thickness falls within the specified 1.37 mm to 1.78 mm range to guarantee proper mechanical fit and electrical contact. Confirm RoHS compliance requirements align with project specifications before finalizing procurement orders.
Select this component when a dual-edge card edge connector with a 3.96 mm pitch is required. The 30-position count suits moderate-density applications. Verify that the panel mount vertical orientation matches the chassis design. Consider the 5 A current rating for power distribution needs. Ensure the gold plating meets corrosion resistance standards for the intended operational environment.
This part belongs to the EDAC 305 Series, which offers various contact terminations and mounting options. The series includes headers and connectors for diverse industrial and medical applications. The 305-030-555-501 specifically addresses dual-edge board connectivity needs with standardized dimensions and durable materials for long-term performance.
Cross-reference compatible parts within the EDAC 305 Series family. Verify identical pitch, position count, and dual-edge configuration. Check for matching flange features and mounting styles to ensure mechanical interchangeability without redesigning the host panel or enclosure structure.
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