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305-036-521-201 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 36POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-036-521-201 is a dual female card edge connector designed for through-hole mounting. It features 36 positions arranged in two rows with a 0.156-inch (3.96mm) pitch. The contacts are made of copper alloy with a gold plating finish, utilizing a semi-bellows contact type to ensure reliable engagement. The insulating material is green polyester thermoplastic, supporting an operating temperature range from -40°C to +105°C. This component is specified for non-designated double-sided cards with thicknesses between 0.054 and 0.070 inches.
Verify the specific ordering suffix against the manufacturer's official 305 Series Ordering Guide to confirm exact pin count, termination style, and plating specifications. Ensure compatibility with the target PCB card thickness limits defined in the datasheet. Confirm RoHS compliance status matches project requirements before finalizing procurement orders.
Select this connector when a dual-row interface is required for double-sided edge cards. Verify that the PCB stack-up accommodates the 0.156-inch pitch and that the card thickness falls within the 0.054 to 0.070-inch operational window. Consider the through-hole termination method for robust mechanical attachment during assembly processes.
This component belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and termination options tailored for high-reliability applications. The 305-036 variant specifically addresses higher-density connection needs while maintaining the standard pitch and form factor characteristic of the family.
Consult the EDAC 305 Series cross-reference documentation for direct substitutes. Ensure any alternative part maintains identical pitch, row count, and contact plating specifications to guarantee mechanical and electrical interchangeability without redesigning the host PCB footprint.
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