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305-036-556-278 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 36POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-036-556-278 is a standard card edge connector header featuring 36 positions with a 3.96 mm pitch. Designed for panel mounting in a vertical orientation, it accommodates PCBs with a thickness of 1.57 mm. The contacts are constructed from copper alloy and feature gold plating to ensure reliable signal transmission. Rated for 5 A current, the unit supports dual-row configurations and operates within a temperature range of -40°C to +105°C.
Verify that the specific part number matches the required 36-position count and 3.96 mm pitch before ordering. Confirm that the application environment remains within the specified -40°C to +105°C operating temperature range. Ensure the mating PCB thickness aligns with the 1.57 mm specification to guarantee proper contact engagement and mechanical stability during installation.
Select this component when a vertical, panel-mount solution is required for dual-row card edge applications. The 3.96 mm pitch and 36-position layout suit systems needing moderate density with robust mechanical fixation. Verify compatibility with mating cards that fit the 1.57 mm thickness tolerance to maintain consistent electrical performance and physical alignment.
This component belongs to the EDAC 305 series of standard card edge connectors. The series provides various position counts and mounting styles for diverse electronic assembly needs. As a header type, it interfaces with corresponding receptacles or card edges to establish stable electrical pathways in industrial and commercial hardware environments.
Cross-reference other EDAC 305 series headers with identical 36-position counts and 3.96 mm pitch. Verify that alternative parts match the vertical panel mount style and dual-row configuration to ensure mechanical and electrical interchangeability without redesigning the host enclosure.
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