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305-040-521-578 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 40POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-040-521-578 is a standard card edge connector from the 305 series, designed for panel mount applications with a vertical orientation. It features 40 positions arranged in a dual row configuration with a contact spacing of 3.96 mm (0.156 inches). The connector accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inches). Electrical specifications include a current rating of 5 A and an insulation resistance of 5 GOhms. The operating temperature range spans from -40°C to +105°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm exact physical dimensions and plating thickness. Ensure compatibility with the target PCB stack-up and mounting hole patterns before procurement. Cross-reference the component number with authorized distributors to confirm availability status and lead times.
Select this component when a robust, high-density connection is required for double-sided cards. The 3.96 mm pitch allows for substantial trace clearance compared to finer pitches. Consider the panel mount style if space constraints on the main chassis allow for external access. Verify that the 5 A current rating meets the power distribution requirements of the application.
This part belongs to the EDAC 305 series, which focuses on standard card edge connectors for general-purpose industrial and commercial use. The series offers various position counts and row configurations. The 305-040 variant specifically addresses mid-range density needs, balancing connectivity volume with manageable footprint size for standard enclosure designs.
Direct substitutes within the same series include parts with identical pitch and row count but different position numbers or housing colors. Verify mechanical fit and electrical ratings before swapping. No alternative cross-brand equivalents are confirmed in public documentation.
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