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305-050-521-208 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 50POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC 305-050-521-208 is a standard card edge connector featuring 50 positions in a dual female configuration. It utilizes a 3.96 mm (0.156 inch) contact spacing with a 5.08 mm row spacing. Designed for .062 inch (1.57 mm) nominal thickness printed circuit boards, the unit accepts between-contact and in-contact polarizing keys. The connector provides a 5A continuous current rating and supports 1800VACrms dielectric strength. It employs gold-plated copper alloy contacts within a green thermoplastic polyester insulator body.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm exact pin count, termination style, and insulation color. Ensure the target application matches the specified 3.96 mm pitch and 1.57 mm board thickness requirements. Confirm compliance with RoHS3 and REACH regulations as stated in the product documentation before finalizing procurement orders.
Select this component when a dual-row female connector is required for 50-position applications. The 3.96 mm spacing accommodates standard PCB layouts while the 5A rating suits moderate power needs. Consider the polarizing key compatibility if precise board insertion orientation is critical for the assembly process.
This part belongs to the EDAC 305 series of standard card edge connectors. The series is characterized by its 3.96 mm contact spacing and versatile mounting options. EDAC designs these components for durability in industrial environments, offering various position counts and termination styles within the same structural family.
Consult the official EDAC 305 Series Ordering Guide for verified substitute part numbers. Cross-reference specifications such as position count, pitch, and termination type to ensure mechanical and electrical compatibility during replacement procedures.
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