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305-064-500-203 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 64POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-064-500-203 is a standard card edge connector from the 305 Series, designed for dual-edge PCB applications. It features 64 positions with a contact spacing of 3.96 mm (0.156 inches) and a row spacing of 3.56 mm (0.140 inches). The connector accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inches). It utilizes gold-plated copper alloy contacts and a green thermoplastic polyester insulator body. Rated for 5 A current, it operates within a temperature range of -40°C to +105°C.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct mounting style and termination type. Confirm that the required PCB thickness aligns with the connector's acceptance specifications. Check regional availability through authorized distributors as supply status may vary. Ensure compliance with RoHS directives if required by the application environment.
Select this component when a 64-position dual-edge interface is required with a 3.96 mm pitch. Consider the vertical panel mount style and solder lug termination for secure installation. Evaluate the 5 A current rating and thermal performance against system requirements. Compare against other series members if different row spacings or contact counts are needed.
This part belongs to the EDAC 305 Series of standard card edge connectors. The series offers various position counts and mounting options. The 305-064-500-203 specifically provides a high-density solution for dual-edge cards. It shares common design characteristics with other parts in the family, such as consistent spacing and material properties.
Public confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing mechanical constraints and electrical specifications before considering alternative components.
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