SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 30818747 is a front panel component designed for electronics packaging systems. It features an unshielded aluminum construction with a pre-anodized finish and plain cut edges. The unit measures 6U in height and 2HP in width, adhering to standard modular spacing dimensions. External width is specified as 20 mm, with a panel thickness of 0.1 inches (approximately 2.54 mm). This accessory is intended for use with frame-type plug-in units, providing structural support and interface definition within rack-mounted assemblies.
Verify the specific revision of the nVent SCHROFF catalog when ordering, as product specifications may evolve. Confirm that the 6U 2HP dimension aligns with your existing frame infrastructure. Ensure compatibility with the intended plug-in unit mounting standards. Check for any specific surface finish requirements beyond the standard pre-anodized option if environmental conditions demand it.
Select this part only if the application requires a 6U height and 2HP width profile. The aluminum material and pre-anodized finish are suitable for general-purpose electronics protection but offer no electromagnetic shielding. Ensure the 0.1-inch thickness meets the mechanical constraints of the host frame. This component is strictly a passive structural element and does not provide electrical functionality.
This component belongs to the nVent SCHROFF front panel series, which provides standardized accessories for modular electronics enclosures. These panels serve as the visible interface and mounting point for internal modules. The 30818747 model represents a specific size variant within this broader family of rack accessories, designed to maintain consistency across different system configurations.
No direct public substitute part numbers are identified for this specific configuration. Compatibility depends on matching the 6U x 2HP dimensions and frame-type mounting interface. Verify dimensional tolerances against existing frames before attempting substitution with generic panels.

Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read MoreA digital-to-analog converter (DAC) turns a digital number into an analog voltage or current. It lets a controller set a physical output, such as…
Read More
Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read More