SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 30847464 is an unshielded front panel designed for 19-inch rack systems. It features a 4U height and 63 Horizontal Pitch (HP) width, with dimensions of approximately 177.8 mm in height and 254.0 mm in width. The panel is constructed from aluminum with a thickness of 2.5 mm. The front surface is anodized, while the rear side is conductive to support grounding requirements. This component serves as a blanking or mounting plate for electronic modules within standard enclosures.
Verify the specific dimensional tolerances and surface treatment specifications against the official nVent SCHROFF datasheet before procurement. Confirm that the 4U by 63 HP configuration matches the intended rack slot availability. Ensure compatibility with existing mounting hardware standards. Check for any recent design change notices (PCN) that may affect material composition or finishing processes. Validate that the unshielded nature meets the electromagnetic interference requirements of the target application environment.
Select this model when a robust, grounded aluminum panel is required for 19-inch rack integration. The 4U height and 63 HP width define the available space for module installation or blanking. Consider the conductive rear surface if grounding continuity is critical for the system. The anodized front finish provides durability without electrical shielding, making it suitable for applications where EMI containment is not the primary concern. Ensure the 2.5 mm thickness aligns with mechanical load requirements.
This part belongs to the nVent SCHROFF range of rack accessories and front panels. These components are designed for use in industrial electronics packaging and standard 19-inch cabinet systems. The product line emphasizes modularity and compatibility with various electronic module formats. Front panels in this series typically serve both functional mounting roles and aesthetic finishing purposes within larger enclosure assemblies.
No public confirmed substitute part numbers are available in the provided documentation. Verify exact dimensional compatibility with alternative suppliers if sourcing from non-OEM channels. Ensure that any replacement maintains the 4U height, 63 HP width, and 2.5 mm thickness specifications.

Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More