30847630

Overview

The Schroff 30847630 is a fill panel component designed for 19-inch subrack systems. It features a Type C configuration with dimensions of 3U height and 8HP width. Constructed from aluminum, the unit provides front anodized and rear conductive surface treatments to ensure mechanical stability and electromagnetic compatibility within electronic packaging assemblies.

Feature Summary

• Provides structural closure for unused slots in standard 19-inch subracks
• Ensures internal shielding through conductive rear surface treatment
• Offers durable protection via front anodized aluminum finish

Applications

• Filling empty slots in modular 19-inch chassis enclosures
• Enhancing EMI shielding in telecommunications equipment racks
• Maintaining airflow management in server infrastructure cabinets

Procurement Notes

Verify exact dimensional tolerances against specific subrack models before integration. Confirm that the 3U by 8HP footprint aligns with the target enclosure's grid system. Ensure surface treatment requirements match environmental conditions. Cross-reference part numbers with official nVent SCHROFF catalogs to avoid substitution errors.

Selection Notes

Select this component when a rigid filler is required for 3U high, 8HP wide openings. Consider the conductive rear finish if shielding continuity is critical. Evaluate the anodized front finish for corrosion resistance. Ensure compatibility with the specific subrack series intended for installation.

Part Context

This item belongs to the nVent SCHROFF range of electronics packaging solutions. The brand specializes in industrial chassis and mounting hardware. This specific part serves as a passive structural element rather than an active electronic component. It supports the organization and protection of plug-in units within standardized rack environments.

Replacement Considerations

Consult official nVent SCHROFF documentation for direct cross-references. Generic equivalents may lack precise dimensional accuracy or conductive properties. Verify compatibility with existing subrack guides and mounting points before substituting.