316-91-119-41-001000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 316-91-119-41-001000 is a 19-position elevated IC socket designed for through-hole mounting. It features a 0.100 inch (2.54mm) mating pitch and utilizes gold-plated beryllium copper contacts with a 0.25µm plating thickness to ensure reliable signal transmission. The connector operates within a temperature range of -55°C to 125°C and is constructed from PCT polyester insulation.

Headers, Receptacles, Female Sockets Feature Summary

• Elevated socket design facilitates board-to-board stacking applications
• Gold-plated beryllium copper contacts provide corrosion resistance
• Through-hole termination ensures secure PCB attachment

Headers, Receptacles, Female Sockets Applications

• Board-to-board interconnect systems
• IC testing and development environments
• Precision-machined interconnect assemblies

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific ordering suffix against official Mill-Max documentation to confirm exact contact geometry and plating specifications. Ensure compatibility with target DIP package dimensions before integration into the final assembly design.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when an elevated profile is required for vertical spacing between circuit boards. Confirm that the 19-pin configuration matches the target integrated circuit footprint and that through-hole processing capabilities are available in the manufacturing workflow.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 316 series, which specializes in high-reliability precision-machined interconnect components. The series is recognized for application-specific solutions manufactured in the United States, ensuring consistent quality standards for critical electronic connections.

Headers, Receptacles, Female Sockets Replacement Considerations

Consult official Mill-Max cross-reference data for verified substitute part numbers. Generic equivalents may not match the precise elevation height or contact material specifications required for this application.