322-43-135-41-001000

$16.52

Description：CONN RCPT 35POS 0.1 GOLD PCB
Series：322
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk

SKU:29f6f2a3f59b Category: Headers, Receptacles, Female Sockets Brand: Mill-Max Manufacturing Corp.

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Product introduction

322-43-135-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 35POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.

Headers, Receptacles, Female Sockets specifications for 322-43-135-41-001000

Description：CONN RCPT 35POS 0.1 GOLD PCB
Series：322
Mfr：Mill-Max Manufacturing Corp.
Package：Bulk
Connector Type：Receptacle
Contact Type：Female Socket
Style：Board to Board
Number of Positions：35
Number of Positions Loaded：All
Pitch - Mating：0.100" (2.54mm)
Number of Rows：1
Row Spacing - Mating：-
Mounting Type：Through Hole
Termination：Wire Wrap
Fastening Type：Push-Pull
Contact Finish - Mating：Gold
Contact Finish Thickness - Mating：30.0µin (0.76µm)
Insulation Color：Black
Insulation Height：0.110" (2.79mm)
Contact Length - Post：0.370" (9.40mm)
Operating Temperature：-55°C ~ 125°C
Material Flammability Rating：-
Contact Finish - Post：Tin
Mated Stacking Heights：-
Ingress Protection：-
Features：-
Current Rating (Amps)：3A
Voltage Rating：-

Headers, Receptacles, Female Sockets datasheet and documents for 322-43-135-41-001000

322-43-135-41-001000

Headers, Receptacles, Female Sockets Overview

The Mill-Max Manufacturing Corp. model 322-43-135-41-001000 is an IC and component socket designed for through-hole mounting. It features a dual-in-line configuration with 35 positions arranged in two rows of 17.5 pins, accommodating standard DIP packages. The connector utilizes solder tail termination for secure board attachment. Contact surfaces are plated with gold to ensure reliable signal transmission and corrosion resistance. This open-frame design facilitates easy insertion and removal of integrated circuits during prototyping or testing phases.

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