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322-91-103-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 3POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 322-91-103-41-001000 is a through-hole receptacle connector designed for electronic interconnect applications. It features three positions with a 0.100-inch (2.54mm) pitch, accommodating standard component spacing requirements. The contacts are gold-plated to ensure reliable signal transmission and corrosion resistance over time. Constructed for surface or panel mounting via through-hole termination, this unit provides a secure mechanical interface for mating with corresponding pins or headers.
Verify the specific pin configuration and mating partner compatibility before integration. Confirm that the through-hole footprint matches the target PCB layout dimensions. Ensure the operating environment remains within standard temperature limits for gold-plated copper alloys. Cross-reference the datasheet for precise mechanical tolerances to avoid assembly conflicts during production.
Choose this component when a compact, three-position connection point is required on a printed circuit board. The through-hole design offers superior mechanical stability compared to surface-mount alternatives in high-vibration environments. The gold finish supports repeated mating cycles without significant degradation. Evaluate space constraints against the 0.100-inch pitch requirement to ensure proper clearance around adjacent components.
This receptacle belongs to the broader family of Mill-Max interconnect solutions, which specialize in precision connectors for diverse industrial sectors. The 322 series typically denotes specific height and termination characteristics within their catalog. As a three-position unit, it serves as a modular building block for larger harness assemblies or single-point connections where minimal footprint is critical for dense board layouts.
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