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323-13-108-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 8POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 323-13-108-41-001000 is a precision interconnect socket designed for through-hole mounting. It features an open-frame construction with 8 positions arranged in a dual-in-line configuration. The component utilizes gold-plated contacts to ensure reliable signal transmission and corrosion resistance. Rated for a maximum current of 3 Amps, it supports operation within a temperature range of -55°C to +125°C. The unit employs standard solder tail termination for secure PCB attachment.
Verify the specific ordering suffix against the manufacturer datasheet to confirm contact plating thickness and terminal length specifications. Ensure the selected variant matches the required pin count and row spacing for the target application. Cross-reference the RoHS compliance status with current regulatory requirements before finalizing procurement orders.
Select this component when a robust, high-cycle DIP socket is required for through-hole applications. The 3 Amp rating and wide operating temperature range suit demanding industrial or commercial environments. Confirm that the 0.100-inch pitch aligns with the target IC footprint and that the open-frame style meets spatial constraints on the printed circuit board.
This part belongs to the Mill-Max 323 series of precision machined interconnect components. The series is characterized by high reliability and durability, manufactured entirely in the United States. These sockets are engineered for applications requiring repeated mating cycles and consistent performance under varying environmental conditions.
Consult official Mill-Max documentation for direct cross-reference substitutes. Verify that any alternative maintains identical pin count, pitch, and termination style to ensure mechanical compatibility without redesigning the host circuit board layout.
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