SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 34561584 is a horizontal guide rail from the EuropacPRO and RatiopacPRO series, designed for rear I/O card mounting in CompactPCI systems. It features an M4 thread interface and measures 431.8 mm in length. Constructed from anodized aluminum, it supports 84 HP horizontal pitch. The component complies with RoHS standards and is intended for integration into rack-mounted chassis environments requiring precise rear connector alignment.
Verify that the required application involves rear I/O card guidance within CompactPCI or EuropacPRO/RatiopacPRO chassis. Confirm compatibility with 84 HP horizontal pitch requirements. Ensure the M4 thread specification matches existing mounting hardware. Check for RoHS compliance if environmental regulations apply to the deployment environment.
Select this rail when rear I/O connectivity is required rather than front access. It is suitable for EuropacPRO and RatiopacPRO series enclosures. The 431.8 mm length accommodates standard CompactPCI rear connector depths. Aluminum construction provides a balance of weight and structural integrity for rack-mounted deployments.
This component belongs to the nVent SCHROFF 34561 Series, part of the broader EuropacPRO and RatiopacPRO product families. These series provide standardized mechanical solutions for industrial computing and telecommunications rack installations. The rail serves as a critical mechanical interface for maintaining alignment of rear-facing electronic modules.
No public confirmed substitute part numbers are available in the provided documentation.
Dutch authorities announced on November 7 the lifting of control measures on Nexperia (formerly NXP Semiconductors’ Standard Products division), marking the end of a…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More