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351-10-124-00-004000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER VERT 24POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Mill-Max 351-10-124-00-004000 is a precision-machined pin header connector designed for board-to-board stacking applications. It features a single row with 24 positions and a standard 0.100-inch (2.54mm) pitch. The component utilizes a clip grid configuration of 00, indicating specific mechanical retention characteristics. Constructed with high-temperature thermoplastic insulators, the header supports reliable interconnect solutions in dense electronic assemblies requiring vertical mounting.
Verify that the clip grid specification matches the target application requirements, as this variant uses a 00 configuration which may differ from standard spring-contact headers. Confirm compatibility with mating receptacles regarding height and alignment tolerances to ensure proper mechanical engagement during assembly processes.
Select this component when precise mechanical dimensions are critical for board stacking heights. The single-row format suits applications requiring linear connectivity without the complexity of multi-row arrangements. Ensure the mating interface accommodates the specific contact length and insulation height parameters defined by the manufacturer's specifications.
This part belongs to the Mill-Max 351 series of interconnect components, which are characterized by their machined rather than stamped contacts. This manufacturing method typically offers superior durability and contact force consistency compared to standard formed pins, making it suitable for high-reliability industrial and commercial electronics.
Direct substitutes must match the 24-position count, single-row layout, and 0.100-inch pitch. Verify that alternative headers maintain compatible clip grid specifications and insulation materials to preserve mechanical fit and thermal performance within the existing assembly constraints.
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