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410-43-202-41-105000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 2POS GOLD SMD. Review the specifications below when checking this part for your BOM.
The Mill-Max 410-43-202-41-105000 is a standard socket header designed for surface mount applications. It features a double-row configuration with two rows of contacts and a mating pitch of 0.100 inches (2.54mm). The termination method utilizes solder, ensuring secure PCB attachment. The connector accepts pin diameters ranging from 0.015 to 0.025 inches (0.381 to 0.635mm), providing compatibility with various lead sizes.
Verify the component matches the specified double-row, surface mount configuration with a 0.100-inch pitch. Confirm that the solder termination type aligns with your assembly process requirements. Ensure the accepted pin diameter range of 0.015 to 0.025 inches is compatible with your mating hardware specifications before finalizing procurement.
Select this part when a surface mount solution is required for double-row interconnections. The 0.100-inch pitch suits standard spacing needs. Consider the mechanical constraints of the four-finger contact design and the specific pin diameter acceptance range. Verify that the solder termination method fits the thermal profile capabilities of the manufacturing line.
This component belongs to the Mill-Max standard socket header series, which provides precision-machined interconnect solutions. These headers are engineered for high reliability in demanding environments. The product line emphasizes consistent performance across various industrial and commercial electronic applications requiring robust surface mount connections.
Direct substitutes must match the double-row, surface mount format with identical 0.100-inch pitch and solder termination. Verify that alternative parts accept the same 0.015 to 0.025-inch pin diameter range. Cross-reference contact material and housing dimensions to ensure mechanical and electrical compatibility without redesigning the footprint.
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