416-41-256-41-008000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 416-41-256-41-008000 is a standard solder tail single in-line package (SIP) socket designed for integrated circuits. It features a through-hole mounting configuration with a 0.100-inch (2.54 mm) contact pitch. The component utilizes gold-plated contacts to ensure reliable electrical connectivity and corrosion resistance. This socket provides a durable interface between the printed circuit board and the IC, facilitating assembly and replacement.

Headers, Receptacles, Female Sockets Feature Summary

• Standard solder tail termination for secure PCB integration
• Gold-plated contact surfaces for enhanced conductivity
• Single in-line package (SIP) form factor

Headers, Receptacles, Female Sockets Applications

• Integrated circuit socketing on printed circuit boards
• Through-hole assembly for electronic modules
• Component replacement interfaces

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific pin count and body length against the official datasheet before procurement. Confirm that the solder tail termination style matches the target PCB layout requirements. Ensure compatibility with the intended integrated circuit package dimensions to prevent mechanical interference or improper seating during installation.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a standard SIP socket with solder tails is required for through-hole applications. Consider the 0.100-inch pitch requirement and verify that the gold plating meets the environmental and durability standards of the target application. Ensure the physical footprint aligns with the available board space and mounting constraints.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 416 series of IC sockets. The series offers various configurations for different IC packages and mounting styles. The 416-41 variant specifically denotes a standard solder tail design within this product line, focusing on reliable interconnection for single in-line packages in electronic assemblies.