416-43-212-41-003000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 416-43-212-41-003000 is a single in-line package (SIP) socket designed for integrated circuits and components. It features standard solder tail termination for through-hole mounting on printed circuit boards. The component belongs to the 416 series, providing a reliable interface for signal transmission between the socket and the PCB traces.

Headers, Receptacles, Female Sockets Feature Summary

• Single in-line package configuration for linear component arrangements
• Standard solder tail termination method for secure board attachment
• Designed as an interconnect socket for ICs and discrete components

Headers, Receptacles, Female Sockets Applications

• Through-hole mounting of single in-line package integrated circuits
• Interconnection sockets for electronic assemblies requiring solder tail termination
• Prototyping and testing environments utilizing SIP component formats

Headers, Receptacles, Female Sockets Procurement Notes

Verify RoHS compliance status and specific packaging quantities directly with the manufacturer or authorized distributors before ordering. Confirm current availability and lead times as supply chain conditions may vary. Ensure the selected variant matches the required pin count and physical dimensions for the target application.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a single row of contacts is required for SIP devices. Verify that the standard solder tail termination aligns with the PCB layout and assembly process. Compare against other 416 series variants to ensure the correct pin spacing and housing length match the specific IC footprint requirements.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 416 series of IC and component sockets. These sockets are engineered for high reliability in various electronic applications. The series offers multiple configurations to accommodate different pin counts and package styles, ensuring compatibility with a wide range of semiconductor devices.