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450-40-238-00-006000 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN HEADER VERT 38POS 2.54MM. Review the specifications below when checking this part for your BOM.
The Mill-Max Manufacturing Corp. model 450-40-238-00-006000 is a vertical header connector designed for board-to-board applications. It features 38 positions with a 0.100-inch (2.54mm) mating pitch and utilizes a double-row configuration. The component employs through-hole termination and push-pull fastening mechanisms. Contact materials consist of copper alloy pins with tin plating, while the insulator is constructed from black PCT material.
Verify the specific pin count matches the required circuit density before procurement. Confirm that the vertical orientation and push-pull fastening type align with the mechanical constraints of the target enclosure. Ensure the through-hole termination method is compatible with the available PCB manufacturing processes and soldering equipment specifications.
Select this component when a high-density vertical connection is required within a standard 2.54mm grid layout. The choice depends on the necessity for a push-pull locking feature to prevent accidental disengagement in vibration-prone environments. Evaluate the physical space requirements against the overall contact length and insulation height dimensions provided in the datasheet.
This part belongs to the Mill-Max 450 series, which specializes in precision machined interconnect components. The series is characterized by high-reliability standards and customizability for demanding electronic applications. As a header connector, it serves as the stationary counterpart to mating sockets or cables in complex electronic assemblies.
Direct substitutes must maintain identical 38-pin counts, 2.54mm pitch, and vertical form factor. Verify that alternative manufacturers offer comparable push-pull locking mechanisms and through-hole termination styles to ensure mechanical interchangeability without redesigning the host PCB footprint.
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