5990281007F

Overview

The Dialight 5990281007F is a green surface-mount LED indicator from the 599 MicroLED series. It features a 1206 (3216 Metric) package with an emerald green lens and water clear transparency. Key electrical parameters include a forward voltage of 3.2V, a test current of 20mA, and a peak wavelength of 525nm. The component offers a luminous intensity of 340mcd and a wide viewing angle of 140 degrees. It operates within a temperature range of -40°C to +100°C and complies with RoHS3 standards.

Feature Summary

• High-intensity emerald green illumination for clear visual indication
• Wide 140-degree viewing angle for enhanced visibility
• Compact 1206 surface-mount footprint for space-constrained designs
• Extended operating temperature range suitable for harsh environments

Applications

• Panel-mounted status indicators in industrial control systems
• Signal lights on medical device interfaces
• Power status LEDs in consumer electronics
• Instrumentation panel lighting

Procurement Notes

Verify the specific suffix '007F' matches the required green color variant and 1206 package dimensions. Confirm RoHS3 compliance requirements against project specifications. Ensure the supplier provides valid traceability documentation for the 599 series components. Check for moisture sensitivity level handling instructions if storage conditions are critical.

Selection Notes

Select this part for applications requiring high brightness in a small SMD form factor. The 140-degree viewing angle makes it suitable for non-direct line-of-sight mounting. Compare the 3.2V forward voltage against available drive circuits. Consider the 20mA test current when designing current-limiting resistors or driver ICs for optimal efficiency and longevity.

Part Context

This component belongs to the Dialight 599 MicroLED series, which focuses on high-performance surface-mount indicators. The series utilizes advanced semiconductor technology to deliver superior luminous intensity compared to traditional LEDs. The 599 series is designed for automated assembly processes, supporting both tape-and-reel and cut-tape packaging options for efficient manufacturing integration.

Replacement Considerations

Direct substitutes within the same series may require verification of exact wavelength and intensity binning. Cross-reference pinout compatibility if replacing in existing PCB layouts. Ensure thermal management capabilities match the original design constraints.