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Product Detailed Parameters
- Description:IC FPGA 600 I/O 1152FBGA
- Series:Stratix® V GX
- Mfr:Altera
- Package:Tray
- Number of LABs/CLBs:158500
- Number of Logic Elements/Cells:420000
- Total RAM Bits:37888000
- Number of I/O:600
- Voltage - Supply:0.82V ~ 0.88V
- Mounting Type:Surface Mount
- Operating Temperature:0°C ~ 85°C (TJ)
- Package / Case:1152-BBGA, FCBGA
- Supplier Device Package:1152-FBGA (35x35)
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Overview
The Altera 5SGXMA4K3F35C3N is a Stratix V GX Field Programmable Gate Array (FPGA) featuring 158,500 Adaptive Logic Modules (ALMs), 420,000 logic elements, and 600 I/Os. It integrates 37,888,000 bits of embedded memory within a 1152-ball FCBGA package. The device operates at a supply voltage of 0.82V to 0.88V and supports a junction temperature range of 0°C to 85°C.
Feature Summary
- Stratix V GX architecture with high-density programmable logic resources
- Integrated high-speed transceivers for serial data communication
- Extensive embedded memory blocks for data buffering and processing
Applications
- High-performance networking equipment
- Industrial automation control systems
- Test and measurement instrumentation
Procurement Notes
Verify the specific suffix 'C3N' against official manufacturer documentation to confirm operating temperature and speed grade. Ensure compatibility with required PCB footprint and thermal management solutions. Confirm RoHS compliance status through current datasheets before procurement.
Selection Notes
Select this component for applications requiring significant logic density and integrated memory within a compact form factor. Evaluate power consumption profiles against available cooling methods. Compare performance metrics with alternative Stratix V variants if higher I/O counts or different speed grades are necessary.
Part Context
This FPGA belongs to the Stratix V GX family, designed for general-purpose high-performance applications. It utilizes advanced silicon technology to deliver efficient logic processing capabilities. The series is known for balancing computational power with energy efficiency in dense packaging configurations.
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