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66527-013LF is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Amphenol ICC (FCI). Its product description is CONN RCPT 26POS 0.1 GOLD PCB R/A. Review the specifications below when checking this part for your BOM.
The 66527-013LF is a BergStik series board-to-board connector manufactured by Amphenol ICC (FCI). It features a 26-position, dual-row socket configuration with a 2.54 mm pitch and 2.54 mm row spacing. Designed for right-angle through-hole mounting, the unit utilizes phosphor bronze contacts with gold plating and a black thermoplastic housing. The connector supports a current rating of 3 A per contact and operates within a temperature range of -65°C to +125°C.
Verify the specific suffix against official manufacturer documentation to confirm exact pin count and orientation. Ensure that the ordering information matches the required BergStik series specifications. Cross-reference the RoHS compliance status and material certifications with the latest datasheet before finalizing procurement orders.
Select this component when a dual-row, right-angle header is required for rigid board-to-board connections. The 2.54 mm pitch accommodates standard PCB trace widths. Verify that the 3 A current rating and operating temperature limits meet the system requirements. Confirm that the through-hole mounting style aligns with the target printed circuit board manufacturing capabilities.
This part belongs to the BergStik family of headers and wire housings produced by Amphenol FCI. The series provides standardized rectangular connectors for various electronic applications. The 66527-013LF specifically represents a 26-position variant designed for robust mechanical retention and electrical stability in demanding environments.
Consult official cross-reference lists for verified substitute part numbers from the same manufacturer. Ensure that any replacement maintains identical pitch, row configuration, and mounting style. Verify compatibility with existing mating connectors before implementation.
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