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712-13-208-41-001000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 8POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 712-13-208-41-001000 is a standard solder tail carrier socket designed for IC and component mounting. It features a through-hole termination method with a bulk packaging format. The unit belongs to the 0712 series and is manufactured by Mill-Max Manufacturing Corp. This specific part number identifies a single-unit configuration intended for direct integration into electronic assemblies requiring reliable mechanical support and electrical connectivity for integrated circuits.
Verify current availability status as distribution channels may indicate regional sales restrictions or limited stock levels. Confirm RoHS compliance details directly with the manufacturer or authorized distributors prior to ordering, as environmental certification data requires explicit validation against the latest product specifications and regulatory requirements.
Select this component when a standard solder tail carrier form factor is required for through-hole IC mounting. Ensure the application aligns with the 0712 series specifications and that the bulk packaging format meets production handling needs. Validate mechanical fit and electrical interface requirements against the official datasheet parameters before finalizing the design choice.
This component is part of the Mill-Max 0712 series, which specializes in IC and component sockets. Mill-Max Manufacturing Corp. produces a wide range of interconnect components, including custom and standard solutions for various electronic applications. The 712 model specifically denotes a standard solder tail carrier variant within their broader portfolio of precision connectors.
The 712-13-108-41-001000 is a related standard solder tail carrier from the same series. Verify pin count and mechanical dimensions before substitution to ensure compatibility with existing PCB layouts and IC footprints.
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