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71321LA25TFGI8 is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 16KBIT PARALLEL 64TQFP. Review the specifications below when checking this part for your BOM.
The 71321LA25TFGI8 is a high-speed, asynchronous dual-port static random-access memory (SRAM) manufactured by Renesas Electronics Corporation. It features a storage capacity of 16 kilobits organized as 2K x 8 bits. The device supports independent access to the same memory location from both ports simultaneously. It operates within a supply voltage range of 4.5V to 5.5V and offers an access time of 25 nanoseconds. The component is housed in a 64-pin Thin Quad Flat Package (TQFP) with dimensions of 10x10 mm. It is designed for industrial temperature ranges spanning from -40°C to +85°C.
Verify RoHS compliance status carefully, as specific suffixes may indicate non-compliance with current environmental directives. Confirm package dimensions match the 64-TQFP specification exactly. Check for moisture sensitivity level requirements during handling. Ensure the supplier provides valid traceability documentation for this discontinued series component.
Select this part when true dual-port functionality with integrated interrupt signaling is required. Compare access times against system timing constraints. Verify voltage compatibility with the 4.5V to 5.5V operating range. Consider the 64-TQFP package size for PCB layout constraints. Evaluate thermal performance within the specified industrial temperature range.
This component belongs to the 71321SA/LA family of high-speed dual-port SRAMs. The 'LA' designation typically indicates enhanced features such as battery backup support compared to the standard 'SA' variant. The family is designed for standalone 8-bit operation or expansion into wider data buses when paired with designated slave devices like the 71421 series.
The 71321LA25PFGI is listed as an upgrade alternative with similar specifications but a different package type. Verify pinout compatibility and package dimensions before substitution. Cross-reference datasheet electrical characteristics to ensure functional equivalence in the target application.
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