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71342LA55PF is listed in the Memory IC range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC SRAM 32KBIT PARALLEL 64TQFP. Review the specifications below when checking this part for your BOM.
The Renesas Electronics Corporation 71342LA55PF is a high-speed, 32-kbit (4K x 8) dual-port static random-access memory (SRAM). It features an asynchronous parallel interface with a maximum access time of 55 ns. The device operates on a single 5V power supply within a voltage range of 4.5 V to 5.5 V. It is housed in a 64-pin Thin Quad Flat Package (TQFP) with dimensions of 14x14 mm. The component supports surface-mount installation and includes independent semaphore logic for port arbitration.
Verify the exact suffix 'PF' against official Renesas documentation to confirm package type and temperature range. Confirm RoHS compliance status as historical data may vary. Check current availability through authorized distributors, as lead times and stock levels fluctuate. Ensure ESD handling protocols are followed during assembly due to CMOS technology sensitivity.
Select this component when concurrent independent access to shared memory is required without software overhead. The integrated semaphore logic simplifies design compared to standard SRAMs requiring external arbitration circuits. Verify that the 55 ns speed meets system timing requirements and that the 64-TQFP package fits the PCB layout constraints.
This part belongs to the Renesas 71342 series of dual-port SRAMs. It is functionally similar to other variants like the 71342LA20 but offers different speed grades. The 'LA' designation typically indicates specific commercial or industrial temperature ranges and package variations within the broader product family.
The 71342SA55PFI is listed as an obsolete alternative with similar specifications. Verify pin compatibility and electrical characteristics before substitution. Other 71342 series variants may offer different access times but require validation of semaphore functionality and package dimensions.
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